TSMC breaks ground on third US fab for Apple chips
April 30, 2025, 11:20 am
TSMC has kicked off construction on its third U.S. fabrication facility, slated to produce Apple chips in Arizona. The new ground‐breaking marks another step in the company’s massive U.S. investment drive—albeit with older 4‑nanometer process technology—as it shifts some production onshore amid global supply concerns.
Apple has reaffirmed its commitment to making chips in the United States as Taiwan Semiconductor Manufacturing Company (TSMC) begins construction on its third fabrication facility in Arizona. The facility in Phoenix represents part of a $100 billion investment TSMC pledged in March to make…
TSMC breaks ground for its third Fab 21 module in the U.S., which will produce chips on A16 and N2 process technologies towards the end of the decade.
Following CHIPS act funding, Apple's iPhone processor manufacturer TSMC has continued its Arizona investment with the company breaking ground on a third chip fabrication facility.TSMC has broken ground on a third processor facility in ArizonaFive years after it first announced plans to build one…
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